Research Progress of Sawing Mechanism for Free Abrasive Wire Saw

Abstract

The wire saw for slicing wafers process is free abrasive machining process. In this paper, we summarize the sawing mechanism for free abrasive wire saw, and think that the sawing mechanism is mainly rolling-indenting removal. But there are two forms of the force which causing the abrasives to roll and indent in the workpiece surface, one form the force acts on the abrasives by shear stress and hydrodynamic pressure, another form the force acts on the abrasives by wire saw. We design an experiment to verify the form of the force, and think that the second form of the force mainly causes the abrasive to roll and indent in the workpiece surface.