Abstract
Based on the mechanical physical characteristics of the silicon wafers and the superior processing character of the diamond fly-cutting, the diamond fly-cutting was applied to the machining of the microgroove in the silicon, and the effect of the processing parameters on the machining shape precision of the microgroove arrays in the silicon was mainly studied. Firstly, the cutting model of the microgroove in cross section under the diamond fly-cutting was established and the theoretical curvature radius of the microgroove was obtained. Secondly, the shape precision of the microgroove is deduced. Finally, the processing experiment of the microgroove in the silicon was carried out. The experimental results reveal that the higher spindle speed n and the smaller cutting feed f are beneficial to machine the better microgroove in the silicon, but it is important to choose the appropriate cutting depth to machine the better microgroove in the silicon.
Highlights
IntroductionMonocrystal silicon combines so many excellent properties (such as the stable chemical properties, the enough mechanical strength and excellent electric properties etc.) that it has been applied widely in the optical communication field and the electromechanical device integration field [1, 2, 3]
Monocrystal silicon combines so many excellent properties that it has been applied widely in the optical communication field and the electromechanical device integration field [1, 2, 3]
It is a kind of hard brittle materials, so it is difficult that the cutting process of silicon is a plastic deformation process under the external force, and it is easy that it gets broken, it becomes a difficult problem in the ultra-precision machining field that the high quality microgroove arrays in the silicon pieces is machined [4]
Summary
Monocrystal silicon combines so many excellent properties (such as the stable chemical properties, the enough mechanical strength and excellent electric properties etc.) that it has been applied widely in the optical communication field and the electromechanical device integration field [1, 2, 3]. It is of the important significance that the microgroove arrays in the silicon wafer can be machined in the field of optical-communication and the integration on chip It is a kind of hard brittle materials, so it is difficult that the cutting process of silicon is a plastic deformation process under the external force, and it is easy that it gets broken, it becomes a difficult problem in the ultra-precision machining field that the high quality microgroove arrays in the silicon pieces is machined [4]. The diamond fly-cutting becomes a new ultraprecise machining method in the field of ultra-precise processing of hard brittle material. According to Fig., the materials is mostly removed by the cutter nose during the diamond fly-cutting, so the size of the cutter nose is an important parameter during the cutting process, and the machined quality of the microgroove in the silicon is mainly affected by the size of the cutter nose. Where 'Z is the roundness error of microgroove, rmax is the radius of minimum circumscribed circle of microgroove profile(mm), rmin is the radius of maximum inscribed circle of microgroove profile(mm), r/ is the curvature radius of the microgroove (mm)
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