Research on the design and processing technology of CQFJ ceramic package

Abstract

Based on the existing high-density Multi-layer ceramic technology system, this paper successfully broke through the key technology of lead forming of CQ F J ceramic package for the first time in China, formed the lead bending design rules and processing flow of J-type lead ceramic package, and realized the mass production, processing and application of CQFJ ceramic package. The lead structure of J-type lead ceramic package is more complex than the conventional package with lead structure. It needs to be processed and gold-plated before bending the lead. In the process of forming the lead, the direct contact with the mold and surface of the soft gold layer make scratch on the surface of lead coating which leads to the unqualified appearance of the product. Therefore, the lead processing and forming is the key to the design and processing of the package. In this paper, through the research on the key technology and process of lead forming process and bending die design, we have mastered the processing and forming process of J-type lead ceramic package, realized the processing of J-lead ceramic package, and met the requirements of package appearance inspection and lead firmness. By improving the mass production and development capacity of J-type lead ceramic package, the same kind of ceramic package can be designed and manufactured quickly to meet the needs of different users. On the premise of meeting the requirements of Lead board level weld size, the side lead size is widened to enhance the firmness of the lead. At the same time, the welding part of the lead and the package is led out with a flat structure, and a reasonable solder wrap angle is formed through the side hollow hole welding structure design to ensure the welding strength of the lead. At present, there is no clear specification for the lead firmness test method of J-type lead ceramic package in China. This paper introduces it in detail for users' reference.