Research on maximizing the diamond content of diamond/SiC composite

Abstract

Diamond content is a key factor affecting diamond/SiC composite performance, especially thermal and mechanical properties, but the composite with high diamond content manufacturing is still challenging issues. Hot mold pressing combined with liquid silicon infiltration to make diamond/SiC composites with high diamond content and relative density has been proposed in this paper. In addition, the effect of diamond particle size on the maximization of diamond content as well as properties of the composites were evaluated. The experiment shows that the content of diamond in the composites increases with the increase of the diamond particle size. When the particle size of diamond is 400 µm, the volume fraction of diamond reaches 59.08%. The highest thermal conductivity (ddia= 300 µm) and highest bending strength (ddia= 50 µm) are 616.77 W/m K (It is the maximum TC of diamond/SiC prepared by pressureless infiltration at present) and 380 MPa, respectively. This work provides a novel and efficient preparation method for further improving the thermal conductivity of diamond/SiC composites.