Abstract
The paper presents the results of studies of polymer compositions based on aluminosilicate microspheres. Polyester resin Yarkopol-20 and epoxy glue ED-20, as well as grades of aluminosilicate microspheres K 500 and K150 were chosen as the binder of aluminosilicate microspheres. The obtained thermal conductivity coefficients are comparable with the thermal conductivity coefficients of materials such as fiber asbestos, wood, expanded clay concrete, etc.
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