Abstract
The aim of work consists in the study of interactions on solder/substrate boundary in fluxless soldering of self-hardening Al alloy Al7075. The ZnAl5Mg3 and ZnAl5Cu3 solders were used in experiments. The soldering parameters were as follows: soldering temperature from 350°C to 390°C., acting time of ultrasonic energy 3 to 5 s, ultrasound frequency 20kHz. Soldered joints were assessed by optical light microscopy, EDX microanalysis and XRD analysis. It was found out that the ZnAl5Mg3 solder is composed of β-Zn phase and of eutecticum composed of Mg2Zn11 intermetallic phase. ZnAl5Cu3 solder is composed of β-Zn phase and CuZn5 intermetallic phase in base β-Zn matrix. Due to eutectic reaction between the solder and substrate, strong interaction on boundary was observed. The reaction layer was formed mostly of α(Al)-β(Zn) mixture.
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