Abstract
The work deals with the study of interaction Cu substrate (purity 5N) and Zn4Al and Zn6Al6Ag (purity 4N) solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420°C. Acting time of ultrasonic vibration was 5 s. Soldered joints were assessed by optical light microscopy, EDX microanalysis and DSC analysis. It was found out that the melting temperatures of solders were 404.9°C and 396.9°C. Intermetallic layers (IM) CuZn4 and Cu5Zn8 were formed at the Cu/Zn4Al boundary. At the boundary Cu/Zn6Al6Ag there were formed AgZn3 and Cu5Zn8 IM layers. Shear strength of joint Cu/Zn4Al was 34.5MPa and shear strength of Cu/Zn6Al6Ag was 39MPa.
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