Abstract
Problem statement: The high aspect-ratio electrodeposition was widely used in the manufacture of non-silicon MEMS devices. The wetting of high aspect-ratio micro-structure in electrolyte was important to the uniformity of micro-structure. Approach: In this study, to enhance the wettability of micro-structures in electrolyte, the effect of Sodium Dodecyl Sulfate (SDS) and O2 plasma surface modification were discussed. Contact Angles (CA) between nickel sulfamate and the micro-structure were investigated to test the effect of two ways mentioned above. We employ the plasma photoresist-removal machine to modify micro-structure made of photoresist and the effects of different modification time were also discussed. The mechanism of O2 plasma treatment was investigated. According to Cassie’s law, a new method was proposed to follow the wetting progress of micro-structure. Results: The contact angles between the electrolytes with SDS and smooth photoresist surfaces exposed to O2 plasma surface modification decreased from 90-5.2° continuously. The maximum SDS concentration was 1g L−1 and the longest modification time was 60s. After 30min’s quiescence, the micro-structure was completely filled by electrolyte, with the size of 50×50×50 µm (width×width×height×). Conclusion/Recommendation: It was possible to promote the wettability by introduction of SDS as wetter and the employment of O2 plasma surface modification. The effect of O2 plasma surface modification could be attributed to the introduction of free and associated hydroxyl.
Highlights
Unlike conventional silicon-based MEMS process, the non-silicon methods to fabricate MEMS devices have been widely used (Duan et al, 2006; Wisitsoraat et al, 2006; Xiao-Chuan, et al, 2009; Haogang et al, 2009; Yuan et al, 2003; Yuan et al, 2006; Gaoyin et al, 2009; Yibo et al, 2010a;2010b; Zhuoqing et al, 2009; Haogang et al, 2008a;2008b; Xiaofeng et al, 2008)
The width of the micro-cavity of combination of the introduction of wetter and O2 micro-structure was only 50um, it was impossible to Plasma surface treatment, the wetting process of observe the wetting process directly
While the concentration of Sodium Dodecyl Sulfate (SDS) increased to 0.5g L−1, the contact angle decreased to 29.4°
Summary
Unlike conventional silicon-based MEMS process, the non-silicon methods to fabricate MEMS devices have been widely used (Duan et al, 2006; Wisitsoraat et al, 2006; Xiao-Chuan, et al, 2009; Haogang et al, 2009; Yuan et al, 2003; Yuan et al, 2006; Gaoyin et al, 2009; Yibo et al, 2010a;2010b; Zhuoqing et al, 2009; Haogang et al, 2008a;2008b; Xiaofeng et al, 2008). The metal micro structure was formed (Fig. 1e). Plasma treatment is the most popular surface modification process of polymer. In aspect-ratio patterned electrodeposition, as the aspect-ratio increased continuously, because of surface tension and the air trapped in the micro-cavity, mass transferring of electrolyte in the micro-cavity became more and more difficult (Yang and Kang, 2000; Iskandarani and Shilbayeh, 2005). To enhance the mass transferring in micro-cavity is very useful to the improvement of the uniformity of electrodeposition. Small cold that the promotion of wettability of electrolyte would plasma zone treatment is an important modification improve the quality of electrodeposition. It is possible to promote the hydrophilicity of microstructure consisted of positive photo-resist by plasma treatment. There are two different models to describe the wetting process of rough surface, the Wenzel’s (Patankar, 2003)
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
