Abstract
Removal of organic solvents for the purpose of manufacturing of solvent-free pressure-sensitive adhesives The present report reports on the process of the removal of organic solvents in the polymerisation reactor, thin-layer evaporator, and twin-screw extruder for the production of the solvent-free acrylic pressure-sensitive adhesives (PSA). New applications and technical specifications stimulate the continuous development of new methods of manufacturing of non-solvent self-adhesives. The new synthesis of 100% acrylic systems includes solvent polymerisation and finally a removal of volatile organic compounds in a special extruder, polymerisation vessel or an industrial evaporator. The removal process requires controlling such relevant parameters as temperature, pressure and volatile organic compounds concentration.
Highlights
The term pressure-sensitive adhesives (PSA) is described by a very precise technical definition and is used extensively in chemical literature[1]
The properties, which are essential in characterizing the nature of PSA, comprise: tack, peel adhesion, and shear[2]
Pressure-sensitive adhesives are used for various products represented by adhesive tapes, labels, protective and decorative foils, and medical pads
Summary
The term pressure-sensitive adhesives (PSA) is described by a very precise technical definition and is used extensively in chemical literature[1]. The hot-melt kinds, dispersion kinds, and other technologies for non-solvent PSA are being realised as part of the PSA applications[3]. These three different manufacture processes that are industrially applied, include:. – polymerization in the twin-screw extruder and a removal of volatile compounds,. The following experiments were conducted in order to study the diverse polymerisation technologies in combination with the removal of organic solvent and volatile free monomers. According to polymerisation technology the basic acrylic PSA was synthesised by using 2-ethylhexyl acrylate (44.5 wt.%), butyl acrylate (30 wt.%), methyl acrylate (20 wt.%), acrylic acid (5 wt.%) and 0.5 wt.% of unsaturated photoinitiator 4acryloyloxy benzophenone. Adhesion and cohesion of the investigated acrylic pressure-sensitive adhesives were tested according to A.F.E.R.A. 4015 (tack), 4001 (adhesion) and 4012 (cohesion) procedures
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