Abstract
Additive printed circuits have found applications in a number of flexible hybrid electronics applications. Examples include printed antennas, sensors, and capacitive touch. Realization of single-layer and multi-layer electronics circuits requires the process-recipes, performance and reliability for attachment of components on additively printed metallization. In this paper, the process-performance correlations have been studied for electrically conductive adhesives (ECA) and low-temperature solders (LTS) for attachment of components to inkjet additively printed circuits. The frequency performance of additively printed signal-processing circuits in wearable applications has been studied. Filters are used in a variety of electronic circuits for noise-filtering, signal synthetization and isolation of specific frequency components using of low-pass, high-pass and band-pass filters. While the feasibility of printed electronics using inkjet has been demonstrated previously, the performance and reliability of inkjet printed circuits with surface-mount devices is not well understood. In this paper, Inkjet printed electronic circuit process recipes have been developed for copper and silver multilayer printing and component integration. Process-performance-reliability of component attachment methods on ink-jet additively printed metallization has been examined for signal filtering in wearable applications. Electrical and mechanical properties are quantified along with demonstration of functional electronic circuits with surface-mount components consisting of frequency-filters and signal-amplifiers. The interaction of process recipes with the mechanical and electrical performance has been studied. The realized performance has been compared with the expected performance from simulations. Use-cases have been compared for performance between additively printed and subtractive-fabricated circuits.
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