Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

Abstract

Abstract Due to its high resolution and ability to deposit a variety of functional materials, including conductive inks, insulators, and dielectrics, inkjet printing is a viable method for constructing such devices. In this study, the authors sought to examine the electrical and mechanical performance of surface-mounted device (SMD) components mounted on inkjet-printed circuits using two adhesives: Electrically Conductive Adhesive (ECA) and Magnetically Oriented Anisotropic Conductive Adhesive (MOACA). The study is carried out this investigation in two phases. In the initial phase, SMD components such as resistors, inductors, and capacitors were mounted using ECA and MOACA on conductive traces with pads, and their electrical performance was compared to their rated values. In the second phase, the behavior of inkjet-printed Circuits was studied, including Non-Inverting Amplifier Circuit and Schmitt Trigger Circuit. These functional circuits were constructed on polyimide substrates. The researchers utilized silver nanoparticle ink. Evaluation of the electrical and mechanical performance of the circuits was done. Overall, this study gives invaluable insight into inkjet-printed circuits’ electrical and mechanical behavior, particularly in the context of attached components.