Abstract
Purpose – The purpose of this study is to investigate the reliability of flip chip joints made with anisotropic conductive adhesives (ACA) on flexible polyimide (PI) and liquid crystal polymer (LCP) substrates.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
