Abstract
A significant need exists for the determination of critical stress characteristics within the low-cost overmolded flip-chip (OM-FC) packages. A systematic stress analysis is reported to investigate the OM-FC package for the optimal design of package geometries, materials combinations during the attachment, and thermal testing processes. A parametric study is conducted seeking the best package performance during the identified most stringent process which causes the largest stress within the low-cost substrate. High-stress location is predicted by finite-element analysis, and it was found that mold compound (MC) curing is the most stringent process for the reliability of substrate; higher underfill fillet, thicker die, larger die size without causing edge effect, solder mask defined structure resulted in smaller stresses in substrate. MC with lower coefficient of thermal expansion is a preferable and compliant substance that is good for using as molding and underfill material
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call