Abstract
The results to date of a reliability testing program for the European Space Agency on high-pin-count hermetic ceramic packages are presented. The objectives of the program, which commenced in 1988, are discussed. Results are presented from work on: application of scanning acoustic microscopy (SAM) to die attach and lid seal quality assessment; the use of thermal characterization test chips and a computer controlled thermal resistance measurement system to measure thermal impedances of ceramic quad flat pack (CQFP) and ceramic pin grid array (CPGA) packages; numerical prediction and practical measurement of electrical parasitics of CQFP and CPGA packages; quality and reliability testing of CQPF and CPGA packages; and quality and reliability testing of 20- and 25-mil pitch surface-mount solder assemblies of high-pin-count CQFP packages assembled on printed circuit boards. >
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