Abstract
Like the widely-used semiconductor switch, Insulated Gate Bipolar Transistors (IGBTs) are subject to many failures and degradation in power electronic converters. In Short Circuit Fault (SCF), as the most reported failures in IGBTs, drastic, sudden temperature rise, and peak SCF current are widespread failures owing to a relatively long delay of the protection subsystem. This paper proposes a protection strategy to limit the junction temperature rise by limiting the SCF current by adding a small value resistor in the IGBT emitter. Second, it reduces the SCF current to a value much less than the saturated current. With the proposed control approach, sudden temperature rise during SCF is controlled, preventing significant failure in IGBTs. The extension of the permissible SCF time is achieved even for the cases with temporary arcs. A simple control loop activates in the SCF condition and does not create slow transients for the IGBT. The results of this paper are validated through simulation and experiment.
Highlights
Insulated Gate Bipolar Transistors (IGBTs) are one of the most important components in medium and high power converters
The first advantage is useful for the IGBTs with a small die where their junction temperature may considerably increase in Short Circuit Fault (SCF) condition, and the failure in the turn-off state can be avoided by the proposed approach
We describe our proposed method in two phases: (1) the SCF peak current value of the IGBT is limited by a small value resistor in the device emitter connection, and (2) the limited SCF current is controlled by changing the gate-emitter voltage
Summary
Insulated Gate Bipolar Transistors (IGBTs) are one of the most important components in medium and high power converters. The second protection approach is based on the device current rate of change (di/dt) by sensing the Kelvin inductor voltage [33,34]. This approach has fast response in fault detection condition and is just suitable for the packages with visible Kelvin inductances. Using the SCF current limitation, this paper proposes a novel strategy for avoiding the failure modes under SCF conditions. The first advantage is useful for the IGBTs with a small die where their junction temperature may considerably increase in SCF condition, and the failure in the turn-off state can be avoided by the proposed approach.
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