Abstract
With the development of automotive electronics, the characteristics of device reliability have received widespread attention. The improvement of device reliability primarily depends on the manufacturing process's quality. This work reviews the inherent relationship between manufacturing processes and reliability with a detailed introduction to the components and failure indices of wafer-level reliability testing. Furthermore, it focuses on the complementary metal-oxide-semiconductor (CMOS) manufacturing process and how device reliability can be enhanced through optimization in front-end-of-line and back-end-of-line processes. Reliability serves as a crucial indicator of device quality, and further efforts are required to achieve higher reliability through process optimization.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
