Abstract
Heat seal connectors (HSC) have been evaluated as a regular connection method for electronic components. In order to test the bonding reliability between HSC and the liquid crystal display (LCD) panel, several tests were carried out: thermal aging, thermal shock and vibration tests. The thermal aging test provided a constant condition of 120/spl deg/C for the HSC. The thermal shock test gave the HSC an alteration between extreme environments (-25/spl deg/C to 125/spl deg/C). The HSC peel strength after thermal aging decreased rapidly within the first 50 hours of aging, increased again and reached a peak at 150 aging hours. Afterwards, the peel strength decreased gradually. For the thermal shock test, the peel strength trend was that it decreased rapidly initially and became constant after 200 cycles of thermal shock. Peel strength after the vibration test fluctuated with the increase in the number of vibration cycles. Moreover, microstructural examination was also conducted on the treated HSC samples. A small reduction in the thickness of the copper tracks inside the HSC was found after thermal aging and thermal shock treatments. Also, some defects were detected which may be related to the decrease in peel strength.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
