Abstract
Abstract In this study the relationships between the composition of phenol resorcinol-formaldehyde resins and paraformaldehyde concentration in the adhesive were explored, using DSC, IR, GPC, and solubility measurements. Differences of chemical composition between base resins and adhesives were compared to the fracture toughness of adhesive bonds. The cure temperature and cure time effects upon fracture toughness were also investigated. Fracture toughness tests were performed with bonded hard maple tapered double-cantilever beam cleavage specimens.
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