Abstract
The fracture of the bonded dissimilar materials generally occurs near the interface or at the interface edge. In this study, the stress intensity factors of the circumferential crack near the interface and the circumferential interface crack are analysed by the crack tip stress method. The relation between the dimensionless stress intensity factor of the circumferential crack and the adhesive thickness is investigated. The dimensionless stress intensity factors are defined by using the singular stress value at the crack tip point in bonded round bar without crack. The dimensionless stress intensity factors based on the singular stress value become constant irrespective of the adhesive thickness. In addition, the dimensionless stress intensity factor of the circumferential crack in bonded round bar is compared with that of the edge crack in bonded plate. Both factors coincide with each other when the geometrical condition and material combinations are the same.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
