Abstract
Abstract Thermal cooling of solder bumps using Under Bump Metalization (UBM) with isotropic undercuts can result in an increase in stress concentration. The stress concentration on the passivation layers can result in cracking, especially when there are surface defects. Opportunities in reducing thermal stress depend on the type of passivation layer design as well as other factors. In Part I of this series of papers, the focus is on optimizing the thickness of the standard passivation design. In the standard passivation layer design, dielectrics would conformally cover the top metalization through two series of Chemical Vapor Deposition (CVD) coatings. Change in thickness for the two passivation layers' thickness using Finite Element Analysis (FEA) techniques combined with statistical Design of Experiments (DOE) allowed optimization of these layer thicknesses which brought about minimal stress on the passivation.
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