Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders

Abstract

The rhombohedral structure is with anisotropic properties, leading to brittle mechanical properties. However, it is one of the major constituent phases, the (Bi) phase, in the Sn–Bi-based low-temperature solders, which is demanding in the electronic industry for reducing the soldering temperature and alleviating the warpage in high-density fine-pitch electronic packaging. Herein, we proposed a high-performance Ag-alloyed Sn–Bi (SBA) low-temperature solder by reducing the fraction and, more importantly, the anisotropy of the (Bi) phase. We found that the (Bi) phase exhibited considerable solubility for Ag and Sn, even after thermal aging, without any nanoprecipitates as confirmed with both CALPHAD-type thermodynamic modeling and high-resolution TEM. The solution effects of Ag and Sn in the (Bi) phase is elaborated based on in situ nano-indentation, EPMA compositional analyses, EBSD characterizations, and ab initio calculations. The presence of Ag and Sn in the (Bi) phases resulted in both solid solution hardening and softening effects, depending on the Schmid factor of the grain. As a result, in (Bi) polycrystals, alloying could effectively mitigate the anisotropic mechanical properties of the (Bi) phase and facilitated a more uniform dispersion of forces exerted among (Bi) grains in all orientations. Consequently, the designed SBA solder exhibited superior mechanical properties, e.g., an ultimate tensile strength (UTS) of 55 MPa, elongation of 46%, and toughness of 20.6 × 106 J/m3 at a strain rate of 0.0005 s−1. This understanding opens the door for enhanced rhombohedral phase in alloy design for various applications.