Redox Behavior of Arsenic (III) and Copper (II) Mixtures on Ultraflat Au (111) Thin Film Electrodes

Abstract

The electrochemical behavior of arsenic on gold (Au) electrodes surfaces is of great interest as As is well-recognized as a highly toxic and relatively ubiquitous ground water species. The United States Environmental Protection Agency (USEPA) and World Health Organization (WHO) drinking water standards for arsenic are 10 PPB, or 𝜇g L-1 [1]. These minute ion concentrations necessitate the use of analytical methods with high sensitivity and a low susceptibility to cross interferences. Electrochemical stripping voltammetry is a well-established electroanalytical method for arsenic ions [2]. Polycrystalline gold electrodes are often used due to their high redox stability and relatively low overpotential for hydrogen evolution. We recently explored the use of ultra-flat, thin film, Au(111) electrodes to replace polycrystalline Au for As stripping voltammetry. Previous studies on oriented single crystals showed relatively narrow stripping peaks with greatly improved peak to background ratios on the (111) surfaces [3]. We observed comparatively similar or better stripping behavior on the Au(111) thin film electrodes with correspondingly far less gold usage per electrode. Unfortunately, copper is a known interference for arsenic stripping electroanalysis, with a strong affinity for UPD deposition on gold. We therefore studied the deposition behavior of Cu on Au(111) thin film electrodes and the co- deposition of Cu and As on the Au(111) thin film electrodes to evaluate cross interference effects. Copper redox behavior in 0.5M H2SO4 was characterized by cyclic voltammetry, electro- deposition and linear stripping voltammetry (LSV) measurements. Strong Cu UPD behavior was observed on Au(111) thin films with sharper, better defined redox peaks than polycrystalline electrodes. Arsenic and Cu ions were also co-deposited over a wide range of Cu (II) and As (III) concentrations. Complex redox behavior was observed with strong indications of Cu-As alloy formation. This was confirmed via angle resolved, X-ray Photoemission Spectroscopy (XPS) measurements. Our results also indicate that the electrodeposition efficiency during LSV of As is increased by the co-deposition of Cu. The results of this study have important implications for understanding the nature of Cu (II) interference with electrochemical detection of trace As (III) in water.[1] USEPA. National Secondary Drinking Water Regulations. 2009. https://www.epa.gov/sdwa/drinking-water- regulations-and-contaminants (accessed.[2] USEPA. METHOD 7063: ARSENIC IN AQUEOUS SAMPLES AND EXTRACTSBY ANODIC STRIPPING VOLTAMMETRY (ASV). 1996.[3] Casuse-Driovínto, T. Q.; Rizo, R.; Benavidez, A.; Brearley, A. J.; Cerrato, J. M.; Garzon, F. H.; Herrero, E.; Feliu, J. M. Increased Sensitivity and Selectivity for As(III) Detection at the Au(111) Surface: Single Crystals and Ultraflat Thin Films Comparison. The Journal of Physical Chemistry C 2022, 126 (48), 20343-20353. DOI: 10.1021/acs.jpcc.2c05541.