Abstract
This Chapter provides an overview of current and future deployment of recycling some noble metals on interconnect metals used in semiconductor assembly and packaging. Also, with the aim to study the key technical barriers, challenges of deployment and its reliability performance of both recycled gold (Au) and recycled copper (Cu) in semiconductor device packaging. This paper lays out the importance of ensuring noble metals in terms of its materials sustainability for the next decade. This article briefly reviews key aspects of deployment of recycled Au wire, recycled Cu, and other noble metals in semiconductor packaging and assembly. List of key technical challenges have been covered in this paper. The research trends on Sustainable Development Goal (SDG) technological and materials aspects highlight the critical role of recycling noble metals technology in semiconductor industry. At the end of this chapter, summary and key recommendation of future works have been provided for better clarity and reference purposes.
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