Recovery prevention via pressure control in thermal nanoimprint lithography

Abstract

In order to investigate the nonuniformity occurring below wider patterns during thermal nanoimprint lithography, the pressure situation is analyzed in detail. A balance of vertical forces shows that the gas pressure within the cavities is negligible, whereas the effective pressure acting on the stamp structures in contact to the polymer is increased compared to the externally applied pressure. This effective pressure has a high hydrostatic component, which may result in local stamp deformation. Imprint with a low molecular weight polymer provides evidence that the stamp structures become compressed under high pressure, resulting in a nonuniform residual layer beneath the imprinted patterns. In contrast, bending deformation of single stamp structures is found to be negligible. Pressure reduction is effective to reduce stamp compression, improving the uniformity of the residual layer. With typical imprint polymers of medium molecular weight, however, pressure reduction reduces the overall imprint depth.