Record peak current density of over 1500 kA/cm2 in highly scaled AlN/GaN double-barrier resonant tunneling diodes on free-standing GaN substrates

Abstract

This work demonstrates high-performance AlN/GaN double-barrier resonant tunneling diodes (RTDs) with high peak current density grown by plasma-assisted molecular beam epitaxy on c-plane free-standing GaN substrates, featuring stable and repeatable negative differential resistance (NDR) characteristics at room temperature. By scaling down the barrier thickness of AlN barrier and the lateral mesa size of collector, the record peak current density of 1551 kA/cm2 is achieved along with a peak-to-valley current ratio (PVCR) of 1.24, which is attributed to the reduced resonant tunneling time under thinner AlN barrier and the suppressed external incoherent valley current by reducing the dislocation number contained in the RTD device with the smaller size of collector. By statistically analyzing the NDR performance of RTD devices with different thicknesses of AlN barrier, the average peak current density increases from 145.7 to 1215.1 kA/cm2, while the average PVCR decreases from 1.45 to 1.1, correspondingly, accompanying with a decreased peak voltage from 6.89 to 5.49 V, with downscaling the AlN barrier thickness from 1.5 to 1.25 nm. The peak current density obtained in this work is the highest value among all the reported nitride-based RTDs up until now while maintaining high PVCR value simultaneously, which illustrates that ultra-scaled RTD based on vertical quantum-well structure and lateral collector size is a valuable approach for the development of nitride-based RTDs with excellent NDR characteristics and reveals their great potential applications in high-frequency oscillation sources and high-speed switch circuits.