Reconfigurable TPM Implemented with Ultralow-Power Management in 28nm CMOS Process for IoT SoC Design

Abstract

There have been amazing developments in the security applications of sensors for Internet of Things (IoT), which lead to the increasing demand for the System-on-a-Chip (SoC) based on Trusted Platform Module (TPM). Low-power design has become the key to enhancing the competitiveness of IoT’s product. The reconfigurable design can effectively reduce power consumption under the condition of ensuring the performance of the system. In this paper, a reconfigurable TPM with a power management module using 28nm CMOS process is proposed, which guarantees the energy saving and effectiveness of the chip. By integrating clock management, power management and multi-voltage management strategy, the designed TPM power management unit achieved a dynamic power reduction level of $$72.61\%$$ , a leakage power reduction level of $$82.05\%$$ and a total power reduction of $$72.68\%$$ with the combination of reconfigurable TPM chips without ultralow-power management.