Abstract
Coolers are used to cool cryogen free devices at temperatures from 5 to 30 K. Cryogen free cooling involves a temperature drop within the device being cooled and between the device and the cooler cold heads. Liquid cooling with a liquid cryogen distributed over the surface of a device combined with re‐condensation can result in a much lower temperature drop between the cooler and the device being cooled. The next logical step beyond simple re‐condensation is using a cooler to liquefy the liquid cryogen in the device. A number of tests of helium liquefaction and re‐condensation of helium have been run using a pulse tube cooler in the drop‐in mode. This report discusses the parameter space over which re‐condensation and liquefaction for helium and hydrogen can occur.
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