Abstract
MEMS research has been carried out through industry-university (Tohoku) collaboration for practical applications. Sophisticated devices such as electrostatically levitated rotational gyroscope, MEMS relay for wafer level packaging, array MEMS including multi-probe data storage and multi-column electron beam lithography system, small diameter fiber optic pressure sensor and SiC micro structure or glass press molding, have been developed. Electrical feedthroughs in glass play important role in the wafer level packaging and array MEMS. Materials such as conductive polymer for recording media, carbon nanotube for electron field emitter, SiC for harsh environment are used in these MEMS because of their unique features.
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