Abstract
MEMS (Micro Electro Mechanical Systems) has been studied for practical applications with attention to packaging. Wafer level packaged devices as integrated capacitive pressure sensor, MEMS relay and electrostatically levitated rotational gyroscope and arrayed MEMS as multi-probe data storage and multi-column electron beam lithography system have been developed. Electrical feedthroughs in glass play important roles in the wafer level packaging and the arrayed MEMS. Materials as diamond for recording probe and carbon nano tube for electron field emitter are utilized in the MEMS for their functionalities.
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