Abstract
Silver based flexible printed electronics offer the possibility to design low-cost environmentally friendly products through versatile manufacturing procedures. In this regard, conductive silver inks are commonly printed on flexible substrates because in contrast to their macroscale analogues, the silver nanoparticles (AgNPs) present different salient physical and chemical properties. However, an extensive application of silver inks is often limited by factors such as a complicated ink preparation process, conflict between ink stability and nanoparticle content, overall ink formulation and selection of suitable sintering techniques. Nevertheless, advances in nanotechnology and printing techniques have opened new rooms to improve the synthesis, stability, processing, and application of silver inks. This review article presents the progress in AgNPs processing, Ag-conductive ink formulation and important printing techniques, especially as it relates to the manufacture of flexible electronics. Furthermore, the significance of the sintering process and the importance of various kinds of sintering methods for improving ink quality and adhesion to substrates are discussed. In addition, some of the notable applications of printed flexible electronics are highlighted.
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