Abstract
At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.
Highlights
At present, the rapid development of highly integrated and high-power microelectronic devices, 5G semiconductor chips, and integrated circuits has led to the continuous reduction in product size and increment in product power [1,2]
There are numerous simulation methods, and this review focuses on the molecular dynamics simulation and ANSYS finite element analysis of thermal conductivity of polymer composites (TCPCs)
The thermal management ability of TCPCs is enhanced so that it can be better-used in electronic equipment
Summary
The rapid development of highly integrated and high-power microelectronic devices, 5G semiconductor chips, and integrated circuits has led to the continuous reduction in product size and increment in product power [1,2]. Many researchers have paid more attention to the study of thermally conductive polymer composites (TCPCs) with outstanding comprehensive properties. They use different materials and various proportions or introduce other new ways to improve λ, in order to reduce the contact thermal resistance of polymer composites, further improve fillers in the polymer matrices distribution, and build a more perfect thermal conduction network [10]. This review introduces several common theoretical models of λ and the characteristics of each model in detail By using these models, the thermal and physical properties of composites can be better-understood, and reasonable prediction results are given.
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