Recent advances in modulated pulsed power magnetron sputtering for surface engineering

Abstract

Over the past 10 years, the development of high-power pulsed magnetron sputtering (HPPMS) has shown considerable potential in improving the quality of sputtered films by generating a high degree of ionization of the sputtered species to achieve high plasma density by using pulsed, high peak target power for a short period of time. However, the early HPPMS technique showed a significantly decreased deposition rate as compared to traditional magnetron sputtering. Recently, an alternative HPPMS deposition technique known as modulated pulsed power (MPP) magnetron sputtering has been developed. This new sputtering technique is capable of producing a high ionization fraction of sputter target species and while at the same time achieving a high deposition rate. This paper is aimed at giving a review of recent advances in the MPP technique in terms of the plasma properties, the improvements in the structure and properties of the thin films, and the important advances in the high rate deposition of high quality thick coatings on the order of 20–100 μm in thickness.