Abstract
Comprehensive SummaryLow dielectric (low‐k) organosilicon polymers have received extensive interests from industry and academia due to good electrical insulation, high temperature resistance, flame retardancy and hydrophobicity. These attractive properties enable them to be utilized as low‐k materials in fabrication of electronic devices in high‐frequency communication technology. This review summarizes recent progress in developing low‐k organosilicon polymers, including the synthetic methods and properties of different organosilicon polymers classified according to the chemical structures. It may provide some inspiration to design new low‐k organosilicon polymers for application in the future.
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