Abstract

OEMs (Original Equipment Manufacturers) and EMSs (Electronic Manufacturing Services) work to a set of guidelines and test procedures for qualification of hardware when changing soldering materials, process conditions, cleaning materials, cleaning machines, and conformal coating. Evaluation and use of any soldering material, reflow setting, or cleaning material, the EMS shall confirm that the proposed materials are characterized and qualified to the applicable ANSI/IPC Industry Standards. Additionally, IPCJ-STD-001G, Amendment 1 issued changes to Cleanliness Standards requiring the assembler to develop objective evidence that a specific cleanliness condition renders a reliable device.For many PCB designs with complex component geometries, cleanliness can impact reliability and circuit performance. The gold standard for circuit qualification has been to pass SIR (Surface Insulation Resistance) testing with resistivity values that show that the design and process do not interfere with the circuit performance. Up until now, SIR testing hasn’t been practical on the manufacturing floor as the test traditionally takes seven days to complete, and requires equipment that is complicated to use. The purpose of this research is to design instrumentation and test methods that allow both the OEM and EMS to perform process development and process control using electrical test methods for use in an operations environment.The research study centers on “On-going Reliability Testing” that allows the assembler to take testing to the technician level. Using a combination of modern, configurable test cards that scrutinize high-risk circuits and devices integrated on the assembly, the EMS can correlate cleanliness to production hardware. This bottom-up testing methodology allows the assembler to repeat IPC testing in their factory – objective evidence to J-STD-001G, Amendment 1. Also, they can expand testing to other areas such as system design, process development, process control, and quality assurance.

Full Text
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