Abstract
Real-time Thermographic Methodology with High-accuracy Temperature Monitoring Applied to Stacked Package of High-power Semiconductor Laser Diode
Highlights
Over the last two decades, an uncooled thermal camera has been widely used in the industrial, medical, and defense fields.[1]
Because of the difference in the processes for the microbolometer and focal plane array (FPA), which are affected by the operating temperature, the signal output from a readout integrated circuit (ROIC) contains some numerical error that results in an inaccurate temperature measurement
An optical zoom-in and stray-radiation sleeve was slipped onto an IR lens with a constant focal length, and the proposed correction methodology for the regression coefficients R, B, F, and O of a microzone temperature-monitoring thermal camera was used for real-time temperature measurement
Summary
Over the last two decades, an uncooled thermal camera has been widely used in the industrial, medical, and defense fields.[1]. For the measurement of temperature on a microzone of 50 μm scale or smaller, a thermal camera must be used with phase-locked microscopy and synchronized thermography. A microzone temperature-monitoring platform with a real-time temperature calibration algorithm was proposed and applied to the package on the submount stage of a high-power semiconductor laser diode (HPSLD) to evaluate its power efficiency.[2,3] Because the size of the temperature monitoring scale is only 100 μm–2 mm, it is suitable for the above needs, that is, it is not necessary to use an expensive lock-in thermographic camera
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