Real-time image segmentation system for IC die patterns

Abstract

A real-time image segmentation system realized for extracting the bond pads in IC die images is presented. The system can work in current IC manufacturing machines with binary-level pattern recognition systems under nearly uniform lighting conditions. The system uses a general-purpose digital signal processor DSP56001 to realize the global thresholding algorithm, and most of the functional blocks are implemented using programmable logic devices. The selection of the thresholding algorithm is based on the characteristics of industrial IC die images.