Abstract
In recent years Directed Self-Assembly (DSA) has come up as a strong candidate technology for advanced lithography. DSA is a complementary technology that is used to enhance established projection lithography. In this paper, an overview is given of activities at imec that are driving towards readying DSA technology for implementation into semi-conductor manufacturing. Flows for line/space and contact hole pattern formation based on chemo- as well as grapho-epitaxy are available and used for understanding process sensitivities, evaluation of defect densities and the demonstration of integration approaches. The state-of-the-art of the various process flows is discussed along with the primary outstanding issues.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
