Inorganic guiding template implementation for DSA contact hole shrink process (Conference Presentation)

Abstract

CH (Contact hole) patterning by DSA (Directed Self-Assembly) of BCP (Block Copolymer) is still attracting interest from the semiconductor industry for its CH repair and pitch multiplication advantages in sub-7nm nodes. For several years, extensive studies on DSA CH patterning have been carried out and significant achievements have been reported in materials and process optimization, CMOS integration and design compatibility and advanced characterization [1-4]. According to these studies, if a common agreement was clearly made for the use of PS-b-PMMA material as a potential candidate for DSA CH patterning integration in advanced nodes, the associated guiding template material was not yet selected and is still under investigation. Whereas the most reported guiding template materials for DSA PS-b-PMMA CH patterning are organic-based (resist or organic hard mask), we propose in this work to investigate a DSA process based on inorganic template material (silicon oxide based). Indeed, this latter offers some advantages over organic template: better surface affinity control, higher thermal stability during BCP self-assembly annealing, easier 3D-morphology imaging of DSA patterns and the possibility of wafer rework after the DSA step. The inorganic template based DSA process was first optimized using the planarization approach [5]. We demonstrated that the silicon oxide thickness should be properly adjusted to allow a good control of the BCP thickness over different guiding template densities. Afterwards, we compared the DSA performances (critical dimension: CD; CD uniformity: CDU, contact misalignment and defectivity) between both inorganic and organic template approaches. Equivalent results were obtained as shown in Figure 1. Finally, we demonstrated that inorganic template allows the rework of DSA wafers: similar CD and CDU for both guiding and DSA patterns were obtained after 3 cycles of rework (Figure 2).