Abstract
Reactive sputter etching has been used to create thinned ‘‘sections’’ of polymer films for use in microstructural analysis. This paper emphasizes the features of the sputter etching process which must be controlled to permit efficient sectioning without the introduction of artifacts, such as microstructural changes induced by heating and surface texture which might obscure subsequent analysis. Sample mounting techniques which allow oxygen sputter etching rates of 20 μm/h without heating of the film above 50 °C and simple electrode surface design rules which allow etching for long periods with very low levels of surface texturing are described. The minimum oxygen flow rates which must be supplied to prevent a depletion of the oxygen reactant and a concomitant reduction in the etch rate are noted. The utility of the technique is demonstrated with results from a study of the microstructure of a cast polypropylene film as a function of depth through the film.
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Schedule a callMore From: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
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