Abstract
Silicon heterojunction (SHJ) cells have shown record efficiencies of 23-25% in recent years and continue to show a promising pathway towards high-efficiency solar cells [1]–[3]. The efficiencies of these cells are typically limited by their series resistance, which results from the high resistivity of the low-temperature silver paste front-grid metallization that are required in SHJ cells. Using reactive silver ink (RSI) and dispense printing offers an alternative to fabricate solar cell front-grids with a low-resistivity compatible with low-temperature processes and all while using 97% less silver. Here we present latest results of our RSI metallization for use on TCO surfaces. We will show how these perfectly metallic inks allow us to redefine the form factor needed in advanced metallization.
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