Abstract
A broad beam ion source using a microwave electron cyclotron resonance (ECR) discharge has been newly developed, giving high reliability in operation. The ion source operates at gas pressures higher than about 3×10-5 Torr, and an ion current density of 1 mA/cm2 is obtained at an ion extraction voltage of 1000 V. By introducing C4F8 and SiCl4 into the ion source, SiO2 and Al are etched at rates greater than 1000 Å/min, with high selectivities and high-accuracy pattern transfer.
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