Reactive Aerosol Jet Printing of 2D and 3D Ag Patterns

Abstract

Printed electronics is a rapidly growing field that involves the use of printing technologies to create electronic devices such as sensors, displays, and solar cells 1. Unlike traditional electronics, which rely on rigid and bulky components, printed electronics can be obtained on flexible and lightweight substrates such as plastic and paper, allowing the development of novel applications such as wearable electronics, smart packaging, and medical sensors. Printing technologies uniquely feature miniaturization and patterning capability at low-cost and high-throughput production. Among them, screen-printing, inkjet printing (IJP) and aerosol jet printing (AJP) are the most employed to fabricate conductive metallic patterns of Ag, Au, Cu and other metal nanoparticles (NPs). These printing techniques typically requires concentrated ink of metal NPs. However, specially in the case of IJP and AJP the synthesis of very small NPs (d < 100 nm) as well as proper ink formulation and long-time stability are major limitations to printing conductive metallic patterns 2.In this work, we propose an innovative method to produce 2D and 3D patterns and structures of Ag NPs by reactive Aerosol Jet Printing (r-AJP) on different substrates, using a custom-built aerosol jet printer. Ag NPs were in-situ reduced coupling two aerosol streams carrying the Ag precursor and a reducing agent, respectively. The process is fast, scalable and cheap. The electrical properties, in terms of both linear and areal electrical conductivity, of the r-AJP silver structures metallization patterns were investigated. Furthermore, the effect of both process parameters and precursor solution physical properties on printed Ag structure and morphology was assessed by x-ray diffraction (XRD) and scanning electron microscopy (SEM) in order to define the optimized condition for high definition 2d and 3D patterns by r-AJP. Bibliography P. Martins et al., Advanced Functional Materials, 33, 2213744 (2023).Y. Sui and C. A. Zorman, J. Electrochem. Soc., 167, 037571 (2020).