Abstract
Elaborating upon the role of surfactant and sonication, this work addresses the combinatorial plating characteristics for the fabrication of nickel ceramic composite membranes. Specific novelty corresponds to controlled addition of hydrazine hydrate as a reducing agent to nickel electroless plating bath. The experimental investigations evaluated the optimality of solution concentrations of cetyltrimethylammonium bromide (CTAB) and sodium dodecyl sulphate surfactants during coupled sonication and surfactant based electroless plating. Among both surfactants, CTAB surfactant with a solution concentration of 4 CMC provided maximum combinations of pore densification (73·4%), metal film thickness (8·4 μm) and plating efficiency (89·9%). In all, it was observed that with CTAB surfactant the pore densification and plating efficiencies increased with increasing surfactant solution concentration from 1–4 CMC and were maximum at 4 CMC which drastically decreased at 6 CMC respectively probably due to surfactant adsorption on the substrate surface.
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