Effect of surfactants on performance of electroless plating baths for nickel–ceramic composite membrane fabrication

Abstract

Nickel–ceramic microfiltration membranes were prepared by electroless deposition of nickel on the activated ceramic membrane substrates having a nominal pore size of 275 nm. Two different surfactants, namely sodium dodecyl sulphate (SDS) and cetyltrimethyl ammonium bromide (CTAB), were studied for their ability to alter the performance characteristics of plating baths as well as composite membranes. Parameters evaluated include the bath conversion, plating efficiency, metal film thickness, average pore size of the composite membranes and per cent pore densification. The overall plating rate was found to increase up to 32% with the addition of SDS and 45% with the addition of CTAB. Addition of surfactants not only resulted in increased film thickness (4–5 μm) but also accounted for considerable reduction in average pore size of the composite membrane. CTAB was found to be more effective and efficient than SDS for nickel membrane fabrication.