Abstract
The effect of rapid-thermal processing (RTP) ambients on the formation of oxygen precipitates and denuded zone (DZ) in heavily boron-doped (HB) Czochralski (Cz) silicon by a low-high (L-H) two-step annealing (800°C∕4h+1000°C∕16h) has been investigated. It was found that after the L-H two-step annealing, there was a high density of bulk microdefects (BMDs) and no observable DZ was formed near the surface in HB Cz silicon wafers preannealed by the RTP in Ar ambient, while the BMD density was quite low in HB Cz silicon wafers preannealed by the RTP in O2 ambient. However, applying the preannealing of RTP sequentially in Ar and O2 ambients allowed us to obtain a high density of BMDs in combination with a sufficient DZ by the subsequent L-H two-step annealing. This approach offers a pathway to optimize internal gettering for HB Cz silicon.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
