Abstract
The characteristics of focused ion beam (FIB) lithography for spin-on-glass (SOG) and PMMA resists were investigated. These resists have high sensitivity around 1 μC/cm 2 and their depth gradations were obtained by using less than 1 μC/cm 2. In particular, FIB lithography working with SOG resists can be used for speedy fabrication of three-dimensional (3D) nanoimprint template. Furthermore, this combination of FIB and SOG has the potential for alternative to EB cutting which is the next generation media mastering technique. Using fabricated SOG template, UV-nanoimprint lithography was carried out and replicated pattern with 59.8 nm gap was obtained.
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