Abstract
β-Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> is an attractive material for highvoltage applications and has the potential for monolithically integrated RF devices. A combination of Raman nanoparticle thermometry measurement and thermal simulation has been used to measure the peak channel temperature due to self-heating in β-Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> MOSFETs. The peak channel thermal resistance measured at the gate surface in the device center was 88 mm · K/W. This value is higher than what has been previously reported using electrical methods, which determine an average temperature over the whole device area. Experimentally validated thermal simulations have been used to propose possible thermal management mitigation approaches.
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