Abstract
Functional verification schemes at a level different from component-level testing are emerging as a cost-effective tool for those space systems for which the risk associated with a lower level of assurance can be accepted. Despite the promising potential, system-level radiation testing can be applied to the functional verification of systems under restricted intrinsic boundaries. Most of them are related to the use of hadrons as opposed to heavy ions. Hadrons are preferred for the irradiation of any bulky system, in general, because of their deeper penetration capabilities. General guidelines about the test preparation and procedure for a high-level radiation test are provided to allow understanding which information can be extracted from these kinds of functional verification schemes in order to compare them with the reliability and availability requirements. The use of a general scaling factor for the observed high-level cross sections allows converting test cross sections into orbit rates.
Highlights
C OMMERCIAL OFF-THE-SHELF (COTS) devices have been gaining popularity within the radiation community during the last two decades, thanks to their higher electrical and electronic performance, when compared to similar rad-hard parts, and to their reduced price and lead time
The radiation testing single-event effect (SEE) [1], [2] and total ionizing dose (TID) [3] standards developed by the community are in a continuous struggle when it comes to keeping up with the innovation introduced by brand new devices which outperform those devices the standards were tailored for
Several aspects of standard space qualification are intrinsically overlooked for this kind of qualification scheme, including TID worst case analysis (WCA), enhanced lowdose-rate sensitivity (ELDRS), and displacement damage (DD) deviations from the non-ionizing energy loss (NIEL) scaling among different materials and destructive SEEs (DSEEs) coverage
Summary
C OMMERCIAL OFF-THE-SHELF (COTS) devices have been gaining popularity within the radiation community during the last two decades, thanks to their higher electrical and electronic performance, when compared to similar rad-hard parts, and to their reduced price and lead time. Interest has been growing around highly integrated solutions manufactured within the same package (e.g., systemon-chip, SoC) or assemblies of discrete devices and integrated circuits (ICs) on printed circuit boards (PCBs), boxes, or modules. The radiation testing single-event effect (SEE) [1], [2] and total ionizing dose (TID) [3] standards developed by the community are in a continuous struggle when it comes to keeping up with the innovation introduced by brand new devices (e.g., flip-chips, multiple chips stacked within the same package, 3-D layouts) which outperform those devices the standards were tailored for. It is noted that for some of these layouts, decapsulation may be unachievable in some cases
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