Quasi-TEM study of microshield lines with practical cavity sidewall profiles

Abstract

This paper presents the quasi-TEM characteristics of microshield lines with practical cavity sidewall profiles. A conformal mapping method is used for the derivation of the electrical parameters of the structures. In this study, numerical results for the characteristic impedances of air-suspended microshield lines with both positive and negative sidewall slopes are presented. Simple and explicit CAD-oriented expressions are proposed for the design and analysis of rectangular-shaped microshield line. Comparisons are made between the results obtained by these formulas and by a standard numerical technique. Furthermore, the sensitivities of the electrical parameters of a rectangular-shaped microshield line to an imperfect sidewall etching process, leading to nonvertical sidewall profiles, are also examined.