Abstract
The technology of three-dimensional (3D) packaging currently provides an increase in the efficiency of various electronic systems, bringing the volume of the package and heat dissipation into proper correlation. For many types of modern 3D packages the electro-thermal properties were not yet investigated. So the thermal modelling of 3D system in package (SiP) constructions became obliged for package designers. The commercial universal fully-3D simulators are not effective for practical engineers because of the complexity in using. The problem-oriented method called “Quasi-3D”was proposed and software tool Quasi-3D-Overheatwas developed to save the pre- and post-processing labour and CPU time. Numerical thermal modelling for different types of modern SiP structures: bridge-chip; p2 Pack; chip stack with TSV; embedded silicon fan-out was carried out and compared with measured temperatures. Simulation error was not more than 10–15%.
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